Organic T-Shirt Production
Sample, revision, and mass production process based on the tech pack.
The Concept
In the rapidly evolving electronics sector, ensuring both conductivity and thermal stability is crucial to maintaining performance. Omnis partnered with a leading tech manufacturer to engineer custom metalized ceramic composites that enhance data transmission speed while effectively dissipating heat, critical for compact, high-frequency devices.
Industry
DTC Fashion Brand
Challenge
Consistent quality with low quantities for the first collection
Material Used
Organic cotton single jersey
Impact
Controlled launch with a MOQ of 100 units
The Challenge
Modern high-frequency circuit boards face two persistent challenges: maintaining signal clarity at high speeds and preventing overheating in increasingly compact device architectures. Our client needed a solution that would simultaneously elevate conductivity and thermal regulation, without expanding the component footprint.
Our approach
Material Innovation
Developed a proprietary ceramic matrix embedded with highly conductive metal oxides to balance electrical flow and thermal dispersion.
Advanced Manufacturing Process
Material bütünlüğünü ve tutarlı iletkenliği sağlamak amacıyla, ardından yüksek sıcaklıkta sinterleme yöntemi uygulanan çok aşamalı bir metalizasyon tekniği uygulandı.
Testing & Validation
Conducted electronic performance testing under high-frequency conditions, along with thermal cycle stress testing to verify durability and heat resistance.
The Results
20%
increase in signal speed.
Reduced
system overheating and thermal stress.
Improved
performance stability in compact environments.
The client
"The materials developed by Omnis gave us a competitive edge in thermal control and transmission speed. They understood our constraints and delivered beyond expectations."
— Isabella T., R&D Lead – NextGen Electronics
Technical specs
Material Composition:
Alumina-based ceramic with silver and copper metallization
Dielectric Constant:
9.2
Thermal Conductivity:
> 30 W/m·K
Operational Range:
-40°C to 200°C
Testing:
RF signal tests & thermal cycle endurance
Applications:
High-frequency PCBs, RF modules, and sensor interfaces
